Wafer Fabrication and Packaging

This module introduces the making of semiconductor devices used in consumer electronics. Participants will learn the technologies and processes of Integrated Circuit (IC) fabrication and packaging and appreciate the extensive effort which goes into the making of an IC chip. The module begins with the processing of the raw material such as sand, which will go through the various wafer fabrication, process integration, and packaging techniques to form the final product.

What You'll Learn

As per course objectives.

Minimum Entry Requirement

3 GCE 'O' Levels passes including English (Grade 1 to 7), Science (Grade 1 to 6) and 1 relevant subject (Grade 1 to 6) with at least 3 years of relevant work experience;

NITEC or NITEC in Technology/Services (GPA 3.5 and above) with at least 2 years of relevant work experience;

Higher NITEC or Higher NITEC in Technology/Services with at least 1 year of relevant work experience;

Relevant WSQ Diploma with at least 3 years of relevant work experience.